• DocumentCode
    311858
  • Title

    Multilayer passive components for uniplanar Si/SiGe MMICs

  • Author

    Gokdemir, T. ; Karacaoglu, U. ; Budimir, D. ; Economides, S.B. ; Khalid, A. ; Rezazadeh, A.A. ; Robertson, I.D.

  • Author_Institution
    Dept. of Electron. & Electr. Eng., King´s Coll., London, UK
  • Volume
    2
  • fYear
    1997
  • fDate
    8-13 June 1997
  • Firstpage
    761
  • Abstract
    This paper describes results for novel multilayer passive components, fabricated on silicon substrates for Si/SiGe uniplanar MMICs. Results are compared for high resistivity silicon, high resistivity silicon with an added polyimide layer, and silicon with silicon dioxide (to represent SOI bonded silicon technology). The components that have been characterized include CPW and TFMS transmission lines and couplers, inductors, capacitors, and planar transformers.
  • Keywords
    Ge-Si alloys; bipolar MMIC; capacitors; coplanar waveguides; elemental semiconductors; inductors; lumped parameter networks; microstrip couplers; microstrip lines; silicon; transformers; waveguide couplers; CPW couplers; CPW transmission lines; SOI bonded silicon technology; Si; Si substrates; Si-SiGe; Si-SiO/sub 2/; Si/SiGe uniplanar MMICs; TFMS couplers; TFMS transmission lines; capacitors; high resistivity Si; inductors; multilayer passive components; planar transformers; polyimide layer; Bonding; Conductivity; Coplanar waveguides; Germanium silicon alloys; MMICs; Nonhomogeneous media; Planar transmission lines; Polyimides; Silicon compounds; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1997., IEEE MTT-S International
  • Conference_Location
    Denver, CO, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-3814-6
  • Type

    conf

  • DOI
    10.1109/MWSYM.1997.602901
  • Filename
    602901