DocumentCode
311884
Title
Pulsed internal-node waveform study of flip-chip MMIC power amplifiers
Author
Bao, J.W. ; Wei, C.J. ; Hwang, J.C.M. ; Wang, R.F. ; Wen, C.P.
Author_Institution
Lehigh Univ., Bethlehem, PA, USA
Volume
2
fYear
1997
fDate
8-13 June 1997
Firstpage
905
Abstract
A pulsed internal-node microwave waveform probing technique was developed and used to characterize flip-chip MMIC power amplifiers. Variations in load impedances were found across the band and different unit cells.
Keywords
MMIC power amplifiers; flip-chip devices; integrated circuit measurement; integrated circuit testing; microwave measurement; waveform analysis; IC testing; flip-chip MMIC power amplifiers; load impedances; microwave amplifiers; microwave waveform probing technique; pulsed internal-node waveform; unit cells; Impedance; MMICs; Microwave amplifiers; Operational amplifiers; Power amplifiers; Probes; Pulse amplifiers; Pulse generation; Pulse measurements; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.602946
Filename
602946
Link To Document