Title :
Response surface methodology-a modeling tool for integrated circuit designers
Author :
McDonald, James ; Maini, Rajnish ; Spangler, Lou ; Weed, Harrison
Author_Institution :
Motorola Semicond. Product Sector, Mesa, AZ, USA
Abstract :
A discussion is presented of an approach to design which allows the designer to analyze a circuit´s output characteristics statistically. The results give the designer the ability to optimize and reduce sensitivity of these output characteristics with respect to process, package, and environmental variations. Examples of the successful application of this technique to design and develop an ECL (emitter-coupled logic) family are discussed. How the results from this statistical technique can be applied to manufacturing and testing are presented
Keywords :
bipolar integrated circuits; emitter-coupled logic; integrated circuit technology; integrated logic circuits; sensitivity analysis; ECL family; IC design; environment sensitivity; modeling tool; output characteristics; package sensitivity; process sensitivity; statistical technique; Circuit simulation; Circuit testing; Delay; Input variables; Integrated circuit modeling; Packaging; Polynomials; Power supplies; Response surface methodology; Temperature;
Conference_Titel :
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location :
Rochester, NY
DOI :
10.1109/CICC.1988.20859
