An integrated folded-patch antenna for wireless microsystems

Author

Mendes, P.M. ; Polyakov, A. ; Bartek, M. ; Burghartz, J.N. ; Correia, J.H.

Author_Institution

Dept. of Ind. Electron., Univ. of Minho, Portugal

fYear

2004

fDate

24-27 Oct. 2004

Firstpage

485

Abstract

A fully integrated, folded-patch antenna for operation at 5.62 GHz and application in wireless sensor networks, has been realized and characterized. Overall dimensions of 4×4×1 mm³, measured bandwidth of 100 MHz and an efficiency of 32% were achieved. The antenna fabrication is based on wafer-level packaging techniques and consists of two adhesively bonded glass substrates with through-substrate electrical vias and 3D metallization. The measured electrical characteristics of the antenna prototype fit well with the simulations.

Keywords

adhesive bonding; integrated circuit metallisation; integrated circuit packaging; microstrip antennas; wafer bonding; wireless sensor networks; 1 mm; 100 MHz; 32 percent; 3D metallization; 4 mm; 5.62 GHz; adhesive wafer bonding; adhesively bonded glass substrates; integrated folded-patch antenna; through-substrate electrical vias; wafer-level packaging techniques; wireless microsystems; wireless sensor networks; Antenna measurements; Bandwidth; Electric variables; Electric variables measurement; Fabrication; Glass; Metallization; Wafer bonding; Wafer scale integration; Wireless sensor networks;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2004. Proceedings of IEEE

Print_ISBN

0-7803-8692-2

Type

conf

DOI

10.1109/ICSENS.2004.1426206

Filename

1426206