Title :
High frequency test structures definition for the study of flip-chip process effects on inductor coupling in a BiCMOS process
Author :
Clément, C. ; Van Haaren, B. ; Gloria, D.
Author_Institution :
ST Microelectron., Crolles, France
Abstract :
Study of flip-chip process effects on coupling between two inductors or an inductor and a ground plane has been achieved to define design rules for device relative placement on silicon and on glass face to face. In this paper, high frequency test structures are described and results from S parameter measurements are presented. HFSS complementary simulations have been achieved to complete the coupling abacus and therefore define design rules.
Keywords :
BiCMOS integrated circuits; S-parameters; circuit simulation; computational electromagnetics; electromagnetic coupling; flip-chip devices; inductors; integrated circuit measurement; integrated circuit packaging; integrated circuit testing; radiofrequency integrated circuits; BiCMOS process; HFSS complementary simulations; S parameter measurements; Si; coupling abacus; design rules; device relative placement; flip-chip process effects; glass; ground plane coupling; high frequency test structures definition; inductor coupling; inductor pair coupling; silicon; BiCMOS integrated circuits; Circuit testing; Face; Frequency measurement; Glass; Inductors; Integrated circuit technology; Position measurement; Radiofrequency integrated circuits; Silicon;
Conference_Titel :
Microelectronic Test Structures, 2004. Proceedings. ICMTS '04. The International Conference on
Print_ISBN :
0-7803-8262-5
DOI :
10.1109/ICMTS.2004.1309478
