Title :
The effect of contact placement on drive currents in 1.25 μm gate arrays: measured and simulated
Author :
Richards, W.R. ; Tsang, J.C. ; Fuller, R.T. ; Goodwin-Johansson, S.
Author_Institution :
Gen. Electr. Microelectron. Center, Research Triangle Park, NC, USA
Abstract :
In the design of CMOS standard-cell and gate-array devices as well as full-custom designs, it is common practice to use a minimum number of source and drain contacts to provide as much routing flexibility as possible for maximum packing density or space utilization. Often devices can be contacted with only a single contact to the source and/or drain regions. This can lead to a serious degradation in device performance due to an increase in the effective source/drain series resistance. This results in part from a spreading resistance effect, leading to current crowding near the contacts because of the potential drop along the width of the device in the source/drain regions. The authors quantitatively study this degradation using device measurements and the two-dimensional device simulator PISCES-IIB for its impact on device designs in a 1.25 μm CMOS gate-array process
Keywords :
CMOS integrated circuits; digital simulation; integrated circuit technology; integrated logic circuits; semiconductor device models; 1.25 micron; CMOS; PISCES-IIB; contact placement; contacts minimisation; current crowding; degradation in device performance; device measurements; drive currents; full-custom designs; gate arrays; gate-array devices; gate-array process; maximum packing density; routing flexibility; series resistance; space utilization; spreading resistance effect; standard cell devices; two-dimensional device simulator; Application specific integrated circuits; CMOS process; Conductivity; Contact resistance; Current measurement; Data mining; Degradation; Doping; Loss measurement; Semiconductor process modeling;
Conference_Titel :
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location :
Rochester, NY
DOI :
10.1109/CICC.1988.20862