Title :
Polyimide planarization for RF-MEMS switches on PCB
Author :
Ghodsian, Bahram ; Jung, C. ; Cetiner, B.A. ; De Flaviis, F.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
Abstract :
This abstract describes an improved manufacturing technology for fabrication of RF-MEMS switches on PCB. The 17.5 μm thick copper layer is patterned and planarized using polyimide. The use of polyimide reduces formation of voids in sacrificial photoresist. Fabricated switches demonstrate low insertion-loss (<0.06 dB at 10 GHz) and good isolation (>20 dB at 10 GHz).
Keywords :
copper; isolation technology; losses; microswitches; microwave switches; photoresists; planarisation; polymer films; printed circuits; 10 GHz; 17.5 micron; Cu; PCB; RF-MEMS switches; insertion-loss; isolation; manufacturing technology; patterned copper layer; polyimide planarization; sacrificial photoresist voids; voids; Antenna accessories; Copper; Dielectric losses; Isolation technology; Planarization; Polyimides; Radio frequency; Radiofrequency microelectromechanical systems; Resists; Switches;
Conference_Titel :
Sensors, 2004. Proceedings of IEEE
Print_ISBN :
0-7803-8692-2
DOI :
10.1109/ICSENS.2004.1426238
