DocumentCode
3120006
Title
PDMS and its Suitability for Analytical Microfluidic Devices
Author
Kuncova-Kallio, Johana ; Kallio, Pasi J.
Author_Institution
Micro & Nanosyst. Res. Group, Tampere Univ. of Technol.
fYear
2006
fDate
Aug. 30 2006-Sept. 3 2006
Firstpage
2486
Lastpage
2489
Abstract
Poly(dimethylsiloxane) also known as PDMS is used in a wide range of biomedical applications. These range from implants through catheters to soft contact lenses. Therefore, it is understandable that PDMS has been extensively tested for these purposes. In past years, the microfluidics has moved from predominantly silicon and glass structures towards polymers due to their ease of manufacturing and moderate cost. PDMS has gained a lot of attention in various analytical applications. However, the testing of its suitability for such applications has not been as thorough as in the biomedical applications, perhaps relying on the experiments from that field. Microfluidic PDMS structures are more and more popular in various analytical devices. Such devices consume less reagents and can work with lower sample volumes. On the other hand, the surface-to-sample-volume ratio becomes larger. That increases the influence of material properties on the actual measurement. Some of the challenges include adsorption, diffusion, surface roughness, permeability and elasticity of PDMS, which are discussed in this paper
Keywords
adsorption; bioMEMS; biomedical materials; diffusion; elasticity; microfluidics; permeability; polymer structure; surface roughness; adsorption; analytical microfluidic devices; biomedical applications; catheters; diffusion; elasticity; implants; material properties; permeability; poly(dimethylsiloxane); soft contact lenses; surface roughness; surface-to-sample-volume ratio; Catheters; Glass; Implants; Lenses; Microfluidics; Polymers; Rough surfaces; Silicon; Surface roughness; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location
New York, NY
ISSN
1557-170X
Print_ISBN
1-4244-0032-5
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2006.260465
Filename
4462299
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