DocumentCode :
3120086
Title :
Accompanying the (re)design of products with environmental assessment (DfE) on the example of ADSM
Author :
Warburg, N. ; Herrmann, C. ; Chiodo, J D
Author_Institution :
Dept. of Life Cycle Eng., Stuttgart Univ., Germany
fYear :
2001
fDate :
2001
Firstpage :
202
Lastpage :
207
Abstract :
Supporting the industry in the design process, the approach described in this paper provides a real design for environment (DfE), including cost aspects. The basis for this form of DfE are the experiences and the data gained in numberless life cycle assessment (LCA) and life cycle engineering (LCE) studies as well as know how in applying generic modeling, simulations and scenario analysis. The method of life cycle costing (LCC) helps to implement economic aspects, which are often the main important aspects in industrial decision making. The goal is to bring environmental and economic considerations in harmony in respect to a sustainable development. LCE/LCA data and experiences shall be used for DfE to objectify the results, by using these scientific proven methods. It is applied and further developed on examples within the `active disassembly using smart materials´ (ADSM) project. The goals of this project are the demonstration of the feasibility of providing a nondestructive, cost effective, self-disassembly system for industry with the smart material device. Within the consumer electronics sector, existing state of the art products without smart materials are analyzed using LCA and LCC. A subsequent analysis with redesigned products consisting of embedded `shape memory alloy´ (SMA) and `shape memory polymers´ (SMP) devices is conducted. As a final stage the analysis is completed with assessed results and will be included in the activity of redesign for further product development
Keywords :
consumer electronics; design for environment; economics; intelligent materials; life cycle costing; recycling; shape memory effects; active disassembly using smart materials; consumer electronics sector; design for environment; economic aspects; embedded shape memory alloy; environmental assessment; generic modeling; industrial decision making; life cycle costing; life cycle engineering; nondestructive self-disassembly system; numberless life cycle assessment; product development; products design; products redesign; scenario analysis; shape memory polymers; state of the art products; sustainable development; Analytical models; Conducting materials; Costing; Costs; Data engineering; Decision making; Environmental economics; Industrial economics; Process design; Shape memory alloys;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2001. Proceedings of the 2001 IEEE International Symposium on
Conference_Location :
Denver, CO
ISSN :
1095-2020
Print_ISBN :
0-7803-6655-7
Type :
conf
DOI :
10.1109/ISEE.2001.924527
Filename :
924527
Link To Document :
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