• DocumentCode
    3120144
  • Title

    Economic and logistical modeling for regional processing and recovery of engineering thermoplastics

  • Author

    Murphy, Cynthia F. ; Dillon, Patricia S. ; Pitts, Gregory E.

  • Author_Institution
    Texas Univ., Austin, TX, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    229
  • Lastpage
    235
  • Abstract
    The economics of processing and recovering engineering thermoplastics from electronic products is not well understood. This is in part due to uncertainty as to the optimum system for collection and processing, and the ongoing challenges in consolidation, identification and sorting of plastics. This paper presents the results from the development of an economics and logistics model for a regional resin processing facility. This work is being conducted in conjunction with the Tufts University Stakeholder Dialogues on Recycling Engineering Thermoplastics. The model focuses on thermoplastics from electronics, and looks at both post industrial waste from molders and OEMs as well as post consumer waste. The approach considers a material flow that returns recovered thermoplastics back into electronic products as well as into alternative applications. Input and participation by companies along the supply chain including OEMs, recyclers, and resin suppliers has been key to the validity of the models
  • Keywords
    economics; plastics; recycling; Tufts University Stakeholder Dialogues; economic modeling; electronic products; engineering thermoplastics; identification; logistical modeling; molders; post consumer waste; post industrial waste; recyclers; regional processing; regional recovery; regional resin processing facility; resin suppliers; supply chain; Conducting materials; Industrial electronics; Industrial waste; Logistics; Plastics; Recycling; Resins; Sorting; Supply chains; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2001. Proceedings of the 2001 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    1095-2020
  • Print_ISBN
    0-7803-6655-7
  • Type

    conf

  • DOI
    10.1109/ISEE.2001.924531
  • Filename
    924531