DocumentCode
3120196
Title
Equipment maintenance focus in defect density improvements IBM microelectronics, Burlington, Vermont
Author
Bilodeau, Matthew P. ; Delibac, W. David
Author_Institution
IBM Microelectron., Burlington, VT, USA
fYear
2004
fDate
4-6 May 2004
Firstpage
22
Lastpage
26
Abstract
In this paper, the process used to increase equipment maintenance involvement in defect density reductions was discussed. Summaries of some of the key actions that were executed as a result of this ongoing process will be described. The long-term results in defect density improvements realized after over 1.5 years of this process will be summarized in this paper.
Keywords
integrated circuit manufacture; integrated circuits; maintenance engineering; production equipment; team working; IBM microelectronics; defect density reduction; equipment maintenance focus; integrated circuits; maintenance engineering; Design methodology; Knowledge engineering; Microelectronics; Monitoring; Portfolios; Rivers; Semiconductor materials; Teamwork; USA Councils; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN
0-7803-8312-5
Type
conf
DOI
10.1109/ASMC.2004.1309528
Filename
1309528
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