Title :
Equipment maintenance focus in defect density improvements IBM microelectronics, Burlington, Vermont
Author :
Bilodeau, Matthew P. ; Delibac, W. David
Author_Institution :
IBM Microelectron., Burlington, VT, USA
Abstract :
In this paper, the process used to increase equipment maintenance involvement in defect density reductions was discussed. Summaries of some of the key actions that were executed as a result of this ongoing process will be described. The long-term results in defect density improvements realized after over 1.5 years of this process will be summarized in this paper.
Keywords :
integrated circuit manufacture; integrated circuits; maintenance engineering; production equipment; team working; IBM microelectronics; defect density reduction; equipment maintenance focus; integrated circuits; maintenance engineering; Design methodology; Knowledge engineering; Microelectronics; Monitoring; Portfolios; Rivers; Semiconductor materials; Teamwork; USA Councils; Vehicles;
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
DOI :
10.1109/ASMC.2004.1309528
