DocumentCode
3120279
Title
Throughput analysis and productivity enhancement for CVD equipment
Author
Hong, Joo-Pyo ; Kim, Jung-Kyoo ; Han, Jae-Hyun ; Chae, Seung-Ki
Author_Institution
Semicond. Bus., Samsung Electron. Co. Ltd., Gyeonggi-Do, South Korea
fYear
2004
fDate
4-6 May 2004
Firstpage
48
Lastpage
51
Abstract
A method for throughput analysis and productivity enhancement of FAB equipment is introduced in this paper. The simultaneous movement of the wafers in the equipment was observed from the graph that was generated based on the wafer history log or the event log of the equipment. The efficiency of the equipment and the productivity of the cluster tool were analyzed based on the tables and the graph. It was verified from the analysis that the equipment was in the transfer bottleneck or the process bottleneck condition. If the equipment was in the transfer bottleneck, actions for the productivity enhancement of the equipment were carried out in transfer viewpoint. Or, if the equipment was in the process bottleneck, the actions were carried out in process viewpoint. Some examples of the throughput analysis and the productivity enhancement for the CVD equipment were shown.
Keywords
chemical vapour deposition; production equipment; productivity; silicon compounds; thin films; CVD equipment; SiH4; cluster tool; fab equipment; process bottleneck; productivity enhancement; throughput analysis; transfer bottleneck; wafers; Fluid flow measurement; History; Mass production; Monitoring; Parallel machines; Parallel robots; Performance analysis; Productivity; Technological innovation; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN
0-7803-8312-5
Type
conf
DOI
10.1109/ASMC.2004.1309533
Filename
1309533
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