DocumentCode
3120315
Title
Strategies for cycle time reduction in batch cleaning
Author
Butterbaugh, Jeffery W.
Author_Institution
FSI Int. Inc., Chaska, MN, USA
fYear
2004
fDate
4-6 May 2004
Firstpage
52
Lastpage
56
Abstract
Wafer cleaning represents up to 15% of the total process steps to build an advanced, 90-nm semiconductor device and is still mainly carried out in batch processes. Performance and throughput advantages are the main reasons for the persistence of batch processing in cleaning. However, concerns about cycle time are driving development of single wafer cleaning processes. In this work, improvement in batch process cycle time is demonstrated. This provides an alternative for maintaining performance and throughput while realizing gains in productivity for cleaning processes.
Keywords
batch processing (industrial); integrated circuit manufacture; semiconductor device manufacture; surface cleaning; 90 nm; batch cleaning; batch process cycle time; batch processing; cycle time reduction; semiconductor device; single wafer cleaning process; Chemistry; Cleaning; Conductors; Electronic switching systems; Manufacturing processes; Performance gain; Productivity; Semiconductor devices; Spraying; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN
0-7803-8312-5
Type
conf
DOI
10.1109/ASMC.2004.1309534
Filename
1309534
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