The development of lead-free printed circuit assembly technology in Hewlett-Packard: our strategy and experience

Author

Henshall, Gregory A. ; Lindsley, Lisa W.

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

fYear

2001

fDate

2001

Firstpage

296

Lastpage

302

Abstract

In this paper, we first describe the technical feasibility of candidate lead-free printed circuit assemblies (PCA) solutions. This discussion focuses on the two major classes of lead-free solders: high temperature, with alloy melting temperatures above that of conventional 63Sn-37Pb, and low temperature, with alloy melting temperatures below that of 63Sn-37Pb. Next, we review HP´s goals for producing lead-free products and strategies for meeting these goals. We then present the current status of our investigations, and finally our key technical and business learnings and recommendations

Keywords

printed circuit manufacture; soldering; Hewlett-Packard; business learnings; high temperature; lead-free printed circuit assembly technology; lead-free products; lead-free solders; Assembly; Consumer electronics; Costs; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Principal component analysis; Printed circuits; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 2001. Proceedings of the 2001 IEEE International Symposium on

Conference_Location

Denver, CO

ISSN

1095-2020

Print_ISBN

0-7803-6655-7

Type

conf

DOI

10.1109/ISEE.2001.924543

Filename

924543