Advanced structural process monitoring, using in-line FIB

Author

Bloess, Harald ; Mata, Carlos ; Zelenko, Jeremy ; Levin, Jacob ; Keisari, Saffi ; Klinger, Jan ; Ventola, Stefano

Author_Institution

Infineon Technol., Dresden, Germany

fYear

2004

fDate

4-6 May 2004

Firstpage

140

Lastpage

143

Abstract

In this paper the challenges of incorporating in-line FIB as process monitor is discussed, for both process qualification phase as well as production phase. Results of advanced FIB capabilities using Applied´s SEMVision G2FIB is demonstrated on some of Infineon´s most challenging process steps, previously lacking in-line capability. In addition, the efforts and results of developing best known methods (BKMs) for FIB milling, deposition techniques (capping) and imaging is discussed and shown comparing results to traditional lab profile measurement techniques.

Keywords

focused ion beam technology; integrated circuit yield; process monitoring; scanning electron microscopy; surface structure; system-on-chip; FIB milling; FIB process; SEMVision G2FIB; advanced structural process monitoring; capping layer; deposition techniques; incorporation; profile measurement techniques; Condition monitoring; Electronic switching systems; Failure analysis; High-resolution imaging; Image analysis; Jacobian matrices; Metrology; Milling; Optimization methods; Production;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop

Print_ISBN

0-7803-8312-5

Type

conf

DOI

10.1109/ASMC.2004.1309552

Filename

1309552