DocumentCode :
3120618
Title :
Advanced structural process monitoring, using in-line FIB
Author :
Bloess, Harald ; Mata, Carlos ; Zelenko, Jeremy ; Levin, Jacob ; Keisari, Saffi ; Klinger, Jan ; Ventola, Stefano
Author_Institution :
Infineon Technol., Dresden, Germany
fYear :
2004
fDate :
4-6 May 2004
Firstpage :
140
Lastpage :
143
Abstract :
In this paper the challenges of incorporating in-line FIB as process monitor is discussed, for both process qualification phase as well as production phase. Results of advanced FIB capabilities using Applied´s SEMVision G2FIB is demonstrated on some of Infineon´s most challenging process steps, previously lacking in-line capability. In addition, the efforts and results of developing best known methods (BKMs) for FIB milling, deposition techniques (capping) and imaging is discussed and shown comparing results to traditional lab profile measurement techniques.
Keywords :
focused ion beam technology; integrated circuit yield; process monitoring; scanning electron microscopy; surface structure; system-on-chip; FIB milling; FIB process; SEMVision G2FIB; advanced structural process monitoring; capping layer; deposition techniques; incorporation; profile measurement techniques; Condition monitoring; Electronic switching systems; Failure analysis; High-resolution imaging; Image analysis; Jacobian matrices; Metrology; Milling; Optimization methods; Production;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
Type :
conf
DOI :
10.1109/ASMC.2004.1309552
Filename :
1309552
Link To Document :
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