Improved process monitoring with Independent Components

Author

Shannon, Thaddeus T. ; Abercrombie, David ; McNames, James ; Whitefield, Bruce

Author_Institution

Syst. Sci. Program, Portland State Univ., OR, USA

fYear

2004

fDate

4-6 May 2004

Firstpage

170

Lastpage

175

Abstract

We propose a method for process monitoring of a semiconductor manufacturing process. Independent Component Analysis (ICA) is applied to characterize E-test parameter data. We calculate angular confidence intervals for the model, eliminate marginally significant components, and implement control charts for significant components of interest. Alarms are generated off of deviations in the charted components. Alarms are easily used in process diagnosis based on the interpretation of the independent components.

Keywords

control charts; independent component analysis; integrated circuit manufacture; manufacturing processes; process monitoring; semiconductor technology; statistical process control; E test parameter data; control charts; independent component analysis; process diagnosis; process monitoring; semiconductor manufacturing process; statistical process control; Fault diagnosis; Independent component analysis; Large scale integration; Manufacturing processes; Microelectronics; Monitoring; Principal component analysis; Process control; Semiconductor device manufacture; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop

Print_ISBN

0-7803-8312-5

Type

conf

DOI

10.1109/ASMC.2004.1309559

Filename

1309559