• DocumentCode
    3121191
  • Title

    Yield learning and the economics of photomasks

  • Author

    Weber, Charles ; Berglund, C. Neil ; Gabella, Patricia

  • Author_Institution
    ETM, Portland State Univ., OR, USA
  • fYear
    2004
  • fDate
    4-6 May 2004
  • Firstpage
    279
  • Lastpage
    284
  • Abstract
    An empirical study, which examines the economic relationship between chip making and mask making, concludes that manufacturers of photomasks operate in a challenging economic environment. High capital cost that is difficult to amortize, pricing pressure, the need for high yield and rapid turn-around, accelerating time-to-market pressure and potential market segmentation present a threat of consolidation in the photomask industry. For photomask manufacturers, sustainable profitability is likely to depend upon transfer of yield-learning knowledge from wafer fobs to mask shops and the ability to develop technology concurrently and collaboratively with their customers and complementers. These factors give semiconductors manufacturers the incentive to invest in internal mask shops or joint ventures that produce leading-edge photomask technology.
  • Keywords
    cost reduction; integrated circuit economics; integrated circuit yield; masks; pricing; profitability; time to market; capital cost; chip making; complementers; customers; economic environment; economic relationship; joint ventures; mask making; mask shops; photomask industry consolidation; photomask manufacturers; photomask technology; potential market segmentation; pricing pressure; rapid turn around time; semiconductors manufacturers; sustainable profitability; time to market pressure; wafer fobs; yield learning knowledge; Acceleration; Costs; Environmental economics; International collaboration; Lead compounds; Manufacturing industries; Pricing; Profitability; Semiconductor device manufacture; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
  • Print_ISBN
    0-7803-8312-5
  • Type

    conf

  • DOI
    10.1109/ASMC.2004.1309582
  • Filename
    1309582