DocumentCode :
3121191
Title :
Yield learning and the economics of photomasks
Author :
Weber, Charles ; Berglund, C. Neil ; Gabella, Patricia
Author_Institution :
ETM, Portland State Univ., OR, USA
fYear :
2004
fDate :
4-6 May 2004
Firstpage :
279
Lastpage :
284
Abstract :
An empirical study, which examines the economic relationship between chip making and mask making, concludes that manufacturers of photomasks operate in a challenging economic environment. High capital cost that is difficult to amortize, pricing pressure, the need for high yield and rapid turn-around, accelerating time-to-market pressure and potential market segmentation present a threat of consolidation in the photomask industry. For photomask manufacturers, sustainable profitability is likely to depend upon transfer of yield-learning knowledge from wafer fobs to mask shops and the ability to develop technology concurrently and collaboratively with their customers and complementers. These factors give semiconductors manufacturers the incentive to invest in internal mask shops or joint ventures that produce leading-edge photomask technology.
Keywords :
cost reduction; integrated circuit economics; integrated circuit yield; masks; pricing; profitability; time to market; capital cost; chip making; complementers; customers; economic environment; economic relationship; joint ventures; mask making; mask shops; photomask industry consolidation; photomask manufacturers; photomask technology; potential market segmentation; pricing pressure; rapid turn around time; semiconductors manufacturers; sustainable profitability; time to market pressure; wafer fobs; yield learning knowledge; Acceleration; Costs; Environmental economics; International collaboration; Lead compounds; Manufacturing industries; Pricing; Profitability; Semiconductor device manufacture; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
Type :
conf
DOI :
10.1109/ASMC.2004.1309582
Filename :
1309582
Link To Document :
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