Title :
Wafer fab cycle forecast under changing loading situations
Author_Institution :
Infineon Technol. AG, Dresden, Germany
Abstract :
This paper describes a successfully applied method to predict future wafer fab cycle time under different fab loading situations. To meet customer demands, a confident cycle time commitment is necessary especially if fab loading will significantly increase. To handle this complex forecast, an easy to use methodology was been developed and successfully used during a+15% fab loading ramp up project. Based on individual work center operating curves, a quite realistic detailed cycle time prognosis for an existing wafer fab was done.
Keywords :
capacity planning (manufacturing); customer satisfaction; demand forecasting; integrated circuit manufacture; production management; fab loading ramp up project; wafer fab cycle time forecast; work center operating curves; Costs; Demand forecasting; Dry etching; Furnaces; Ion implantation; Lithography; Load forecasting; Physics; Semiconductor device manufacture; Wet etching;
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
DOI :
10.1109/ASMC.2004.1309593
