DocumentCode
3121387
Title
Wafer fab cycle forecast under changing loading situations
Author
Beeg, Thomas
Author_Institution
Infineon Technol. AG, Dresden, Germany
fYear
2004
fDate
4-6 May 2004
Firstpage
339
Lastpage
343
Abstract
This paper describes a successfully applied method to predict future wafer fab cycle time under different fab loading situations. To meet customer demands, a confident cycle time commitment is necessary especially if fab loading will significantly increase. To handle this complex forecast, an easy to use methodology was been developed and successfully used during a+15% fab loading ramp up project. Based on individual work center operating curves, a quite realistic detailed cycle time prognosis for an existing wafer fab was done.
Keywords
capacity planning (manufacturing); customer satisfaction; demand forecasting; integrated circuit manufacture; production management; fab loading ramp up project; wafer fab cycle time forecast; work center operating curves; Costs; Demand forecasting; Dry etching; Furnaces; Ion implantation; Lithography; Load forecasting; Physics; Semiconductor device manufacture; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN
0-7803-8312-5
Type
conf
DOI
10.1109/ASMC.2004.1309593
Filename
1309593
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