• DocumentCode
    3121387
  • Title

    Wafer fab cycle forecast under changing loading situations

  • Author

    Beeg, Thomas

  • Author_Institution
    Infineon Technol. AG, Dresden, Germany
  • fYear
    2004
  • fDate
    4-6 May 2004
  • Firstpage
    339
  • Lastpage
    343
  • Abstract
    This paper describes a successfully applied method to predict future wafer fab cycle time under different fab loading situations. To meet customer demands, a confident cycle time commitment is necessary especially if fab loading will significantly increase. To handle this complex forecast, an easy to use methodology was been developed and successfully used during a+15% fab loading ramp up project. Based on individual work center operating curves, a quite realistic detailed cycle time prognosis for an existing wafer fab was done.
  • Keywords
    capacity planning (manufacturing); customer satisfaction; demand forecasting; integrated circuit manufacture; production management; fab loading ramp up project; wafer fab cycle time forecast; work center operating curves; Costs; Demand forecasting; Dry etching; Furnaces; Ion implantation; Lithography; Load forecasting; Physics; Semiconductor device manufacture; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
  • Print_ISBN
    0-7803-8312-5
  • Type

    conf

  • DOI
    10.1109/ASMC.2004.1309593
  • Filename
    1309593