Production implementation of state-of-the-art electron beam inspection

Electron beam inspection (EBI), through the use of voltage contrast, is used extensively throughout the industry to identify in-line electrical failures. The inspection methodologies presented in this paper help us to understand and react to these buried yield detractors in a timely manner. The result is an increase in disposition efficiency and a decrease in mean time-to-detect. This paper will describe the implementation of a state-of-the-art EBI technology into 300 mm wafer manufacturing using the KLA-Tencor eS30 EBI tool. First, results will be shown to demonstrate sensitivity, throughput, and overall production worthiness. Next, we will describe the implementation of this technology into IBM´s 300 mm production line. Finally, we will describe a case study that illustrates the value of this technique for monitoring electrical defectivity in volume production.