Abstract :
The ever increasing global requirement for high efficiency, greater functionality, tetherless, compactness, high integration and cost effectiveness is causing explosive growth in the demand for new and innovative power semiconductor products and techniques for low voltage consumer applications. This paper discusses in detail the existing power conversion topologies and switch requirements for such consumer applications, paying particular interest to the driving factors leading to power device selection. Emphasis is placed on the advancements in silicon and packaging technology of the metal oxide semiconductor field effect transistor that have been witnessed over the last decade and how this has had impact today and, in its present state, the shortfalls for the future low voltage, surface mount market. More specifically, consideration will be given to the latest developments in MOSPOWERTM technology, the market driven innovation of power semiconductor discrete devices for battery management and finally developments and trends in surface mount packaging and their merits
Keywords :
DC-DC power convertors; DC/DC power conversion techniques; MOSPOWERTM technology; battery management; developments; low voltage applications; low voltage consumers; packaging technology; power MOSFET; power conversion topologies; power device selection; power semiconductor products; silicon advancements; surface mount packaging; switch requirements;
