DocumentCode
3121589
Title
Effect of Thermal Power Plant Dusts to the Growth of Some Body Normal Strains
Author
Dong Fa-qin ; Dai Qun-wei ; Deng Jian-jun ; Zeng Ya-li
Author_Institution
Key Lab. of Solid Waste Treatment & Resource Recycle, Southwest Univ. of Sci. & Techonolgy, Mianyang, China
fYear
2010
fDate
18-20 June 2010
Firstpage
1
Lastpage
4
Abstract
This paper studied the growth effect mechanism of thermal power plant dust on three body normal flora. The physics properities, major chemical composition and granularity distributing of the experiment dust were analysis and the change of number of index bacterial colonies, pH, glucose (GLU) and electrolyte relative to the controls were observed. And in the same time, we studied the bacterial form and interface act in the action process of dusts and bacteria through SEM analysis. The reciprocity of thermal power dusts and three body normal strains didn´t bring obvious change on the wastage of GLU, the number of bacterial colonies, pH value and the others electrolyte et al. Compare to the bacterial control groups, the concentrations of Ca2+ and Mg2+ increased 0.69mmol/L (P<;0.05)and 0.16mmol/L (P<;0.05) respectively. The bacteria colonies of Escherichia coli and Staphylococcus epidernidis increased 1×109 CFU/mL and 12×109 CFU/mL (P<;0.05). Thermal power plant dusts of proper concentration have more obvious effect to the growth of Staphylococcus epidernidis than the other strains.
Keywords
air pollution; electrolytes; scanning electron microscopy; thermal power stations; Escherichia coli; SEM analysis; electrolytes; granularity distribution; growth effect mechanism; index bacterial colonies; normal strains; physics properities; staphylococcus epidernidis; thermal power plant dusts; three body normal flora; Capacitive sensors; Cities and towns; Hazards; Hospitals; Humans; Instruments; Laboratories; Microorganisms; Power generation; Sugar;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioinformatics and Biomedical Engineering (iCBBE), 2010 4th International Conference on
Conference_Location
Chengdu
ISSN
2151-7614
Print_ISBN
978-1-4244-4712-1
Electronic_ISBN
2151-7614
Type
conf
DOI
10.1109/ICBBE.2010.5516463
Filename
5516463
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