DocumentCode :
3121648
Title :
A bubble-jet MEMS printhead integrated with CMOS de-multiplexer
Author :
Liou, Jian-Chiun ; Liu, Chien-Hung ; Chen, ChunJung
Author_Institution :
OES, Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear :
2004
fDate :
4-6 May 2004
Firstpage :
413
Lastpage :
419
Abstract :
This paper describes the work aimed to develop a thermal inkjet (TIJ) printhead by using bulk micromachining technology (MEMS). This experiment develops new structure designs of chip for inkjet printheads. A thermal inkjet device is designed, several of the dimensions may be adjusted just a few microns to change or optimize the drop generation performance. This energy conversion devices and systems based on integrated driver head with the performance of high-frequency and picoliter drop Inkjet and structures. A smart CMOS circuit including D Flip-Flops signal-processing along with bi-directional data transfer and 12 V power amplifiers in a printhead chip. All of the jets of the printhead are controlled by very few input lines: a pulse shape (ENABLE), a data line (DATA), a bit shift clock (BIT SHIFT), a clearing pulse, 5-volt supply for the logic devices, a higher voltage for energizing the heater resisters, and a ground line. The fabricated back side etching thermal inkjet (TIJ) printhead is measured by open pool and close pool system. The measured begin voltage is 6.5 V, life time is 9×107.
Keywords :
CMOS integrated circuits; demultiplexing equipment; etching; flip-flops; ink jet printers; integrated circuit design; micromachining; micromechanical devices; 12 V; 5 V; 6.5 V; CMOS circuit; CMOS demultiplexer; D flip-flops signal-processing; back side etching thermal inkjet; bidirectional data transfer; bit shift clock; bubble-jet MEMS printhead; bulk micromachining technology; close pool system; data line; energy conversion devices; ground line; heater resisters; inkjet printheads; integrated driver head; logic devices; open pool system; picoliter drop inkjet; power amplifiers; printhead chip; pulse shape; thermal inkjet device; CMOS technology; Design optimization; Driver circuits; Energy conversion; Flip-flops; Micromachining; Micromechanical devices; Pulse amplifiers; Pulse shaping methods; Shape control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN :
0-7803-8312-5
Type :
conf
DOI :
10.1109/ASMC.2004.1309607
Filename :
1309607
Link To Document :
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