• DocumentCode
    3121661
  • Title

    Silicon carbide in a silicon world: introducing wide band gap semiconductor production into a silicon fab

  • Author

    Shovlin, Joseph ; Woodin, Richard ; Witt, Tony

  • Author_Institution
    Fairchild Semicond. Corp., South Portland, ME, USA
  • fYear
    2004
  • fDate
    4-6 May 2004
  • Firstpage
    420
  • Lastpage
    424
  • Abstract
    The Advanced Materials Group has been tasked with bringing silicon carbide (SiC) device production into an existing silicon fab. The goal is to develop processes maximizing utilization of the existing silicon fab infrastructure. This paper will discuss some of the challenges being faced in this task, and how the group is addressing them. While the processes used to fabricate SiC devices are similar to those used to fabricate silicon devices, there are several important differences.
  • Keywords
    semiconductor device manufacture; semiconductor devices; silicon compounds; wide band gap semiconductors; SiC; SiC device production; SiC devices; advanced materials group; silicon carbide device production; silicon devices; silicon fab infrastructure; silicon world; wide band gap semiconductor production; Conducting materials; Costs; Gallium nitride; Photonic band gap; Production; Semiconductor materials; Silicon carbide; Substrates; Thermal conductivity; Wide band gap semiconductors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
  • Print_ISBN
    0-7803-8312-5
  • Type

    conf

  • DOI
    10.1109/ASMC.2004.1309608
  • Filename
    1309608