DocumentCode
3121661
Title
Silicon carbide in a silicon world: introducing wide band gap semiconductor production into a silicon fab
Author
Shovlin, Joseph ; Woodin, Richard ; Witt, Tony
Author_Institution
Fairchild Semicond. Corp., South Portland, ME, USA
fYear
2004
fDate
4-6 May 2004
Firstpage
420
Lastpage
424
Abstract
The Advanced Materials Group has been tasked with bringing silicon carbide (SiC) device production into an existing silicon fab. The goal is to develop processes maximizing utilization of the existing silicon fab infrastructure. This paper will discuss some of the challenges being faced in this task, and how the group is addressing them. While the processes used to fabricate SiC devices are similar to those used to fabricate silicon devices, there are several important differences.
Keywords
semiconductor device manufacture; semiconductor devices; silicon compounds; wide band gap semiconductors; SiC; SiC device production; SiC devices; advanced materials group; silicon carbide device production; silicon devices; silicon fab infrastructure; silicon world; wide band gap semiconductor production; Conducting materials; Costs; Gallium nitride; Photonic band gap; Production; Semiconductor materials; Silicon carbide; Substrates; Thermal conductivity; Wide band gap semiconductors;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing, 2004. ASMC '04. IEEE Conference and Workshop
Print_ISBN
0-7803-8312-5
Type
conf
DOI
10.1109/ASMC.2004.1309608
Filename
1309608
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