Title :
The Smartpack(R), a low cost high performance solution for power packaging
Author :
Masana, F.N. ; Hinchley, D.A. ; Rahimo, M.T. ; Jones, S.R.
Author_Institution :
Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
Abstract :
In this paper, Semelab introduces the Smartpack(R) novel semi-custom plastic power module. The Smartpack represents a breakthrough in the low cost packaging of semiconductor dies, and is suitable for almost any power electronic application, regardless of complexity. This paper details Smartpack´s construction and demonstrates the module´s thermal efficiency, electrical performance and reliability
Keywords :
power integrated circuits; Smartpack(R); construction; electrical performance; electrical reliability; low cost packaging; power electronic applications; semi-custom plastic power module; semiconductor dies; thermal efficiency;
Conference_Titel :
Recent Advances in Power Devices (Ref. No. 1999/104), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19990601
