Title :
A multi-chip-architecture based flexible stimulation device for retinal prosthesis with a flip-chip packaging technique
Author :
Tokuda, T. ; Kawada, M. ; Sugitani, S. ; Taniyama, M. ; Uehara, A. ; Kagawa, K. ; Nunoshita, M. ; Ohta, J.
Author_Institution :
Nara Inst. of Sci. & Technol.
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
In the present work, we designed a multi-chip-architecture based flexible neural stimulation device for retinal prosthesis. Based on the multi-chip architecture, a novel CMOS stimulation device was successfully designed and characterized. A packaging technique for thin, flexible neural stimulation device was also proposed and demonstrated. Flip-chip bonding technology plays an essential role in the fabrication of the present thin and flexible neural stimulation device
Keywords :
CMOS integrated circuits; bioelectric phenomena; biomedical electrodes; eye; flip-chip devices; neurophysiology; prosthetics; wafer bonding; wafer level packaging; CMOS stimulation device; flexible neural stimulation device; flip-chip bonding technology; flip-chip packaging technique; multichip-architecture; retinal prosthesis; silicon wafers; stimulation electrode; Bonding; CMOS technology; Cities and towns; Electrodes; Large scale integration; Neural prosthesis; Packaging; Prosthetics; Retina; USA Councils;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.260794
