• DocumentCode
    3122336
  • Title

    Noise analysis on integrated multisensor microsystems

  • Author

    Astaras, A. ; Beaumont, S.P. ; Tang, T.B. ; Murray, A.F. ; Wang, L. ; Cumming, D.R.S.

  • Author_Institution
    Inst. for Syst. Level Integration, Livingston, UK
  • fYear
    2004
  • fDate
    24-27 Oct. 2004
  • Firstpage
    995
  • Abstract
    This paper presents an analysis of the noise propagated across the substrate and the electromagnetic contamination in a control chip for a wireless lab-in-a-pill. This chip integrates analogue, digital and radio frequency circuits monolithically to reduce the physical size, power consumption and packaging cost of the capsule. Several approaches to minimise noise effects were proposed and incorporated in a recently fabricated chip. Despite the presence of high frequency noise, the experimental results revealed that 8-bit A/D conversion of the sensory signals was possible with a 3 V power supply.
  • Keywords
    analogue-digital conversion; coupled circuits; electromagnetic interference; integrated circuit noise; microsensors; radio transmitters; sensor fusion; system-on-chip; 3 V; RF transmitter; SoC; capsule; electromagnetic contamination; high frequency noise; integrated multisensor microsystems; microsystem noise analysis; noise coupling; noise effects minimisation; sensory signals A/D conversion; substrate propagated noise; wireless lab-in-a-pill control chip; Circuit noise; Contamination; Costs; Electromagnetic analysis; Electromagnetic interference; Electromagnetic propagation; Energy consumption; Frequency conversion; Packaging; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2004. Proceedings of IEEE
  • Print_ISBN
    0-7803-8692-2
  • Type

    conf

  • DOI
    10.1109/ICSENS.2004.1426340
  • Filename
    1426340