DocumentCode
3122336
Title
Noise analysis on integrated multisensor microsystems
Author
Astaras, A. ; Beaumont, S.P. ; Tang, T.B. ; Murray, A.F. ; Wang, L. ; Cumming, D.R.S.
Author_Institution
Inst. for Syst. Level Integration, Livingston, UK
fYear
2004
fDate
24-27 Oct. 2004
Firstpage
995
Abstract
This paper presents an analysis of the noise propagated across the substrate and the electromagnetic contamination in a control chip for a wireless lab-in-a-pill. This chip integrates analogue, digital and radio frequency circuits monolithically to reduce the physical size, power consumption and packaging cost of the capsule. Several approaches to minimise noise effects were proposed and incorporated in a recently fabricated chip. Despite the presence of high frequency noise, the experimental results revealed that 8-bit A/D conversion of the sensory signals was possible with a 3 V power supply.
Keywords
analogue-digital conversion; coupled circuits; electromagnetic interference; integrated circuit noise; microsensors; radio transmitters; sensor fusion; system-on-chip; 3 V; RF transmitter; SoC; capsule; electromagnetic contamination; high frequency noise; integrated multisensor microsystems; microsystem noise analysis; noise coupling; noise effects minimisation; sensory signals A/D conversion; substrate propagated noise; wireless lab-in-a-pill control chip; Circuit noise; Contamination; Costs; Electromagnetic analysis; Electromagnetic interference; Electromagnetic propagation; Energy consumption; Frequency conversion; Packaging; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2004. Proceedings of IEEE
Print_ISBN
0-7803-8692-2
Type
conf
DOI
10.1109/ICSENS.2004.1426340
Filename
1426340
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