DocumentCode
3122880
Title
Magnetic sensor constructed of a thick BPSCCO film: relationship between magnetic sensitivity and the quenching process
Author
Yamagata, K. ; Maeji, Y. ; Kezuka, H. ; Itoh, M.
Author_Institution
Interdisciplinary Graduate Sch. of Sci. & Eng., Graduate Sch. of Kinki Univ., Japan
fYear
2004
fDate
24-27 Oct. 2004
Firstpage
1078
Abstract
A highly sensitive magnetic sensor composed of a thick Bi-Pb-Sr-Ca-Cu-O (BPSCCO) film, which retained a residual resistance at the boiling point of liquid nitrogen (77.4 K), was fabricated. From experimental results, it was found that the magnetic sensitivity of the sensor increased as the resistivity of the residual resistance decreased. During fabrication, the thick BPSCCO film was sintered using two processes, quenching and sintering processes, by use of an electric furnace. The value of residual resistance was found to be related the sintering time Tp, that is, the time for maintaining a constant temperature of 845°C in the quenching process. The magnetic sensitivity of the thick BPSCCO film magnetic sensor for a Tp value of 5 hours, was about 27%/(10-4 T) over the magnetic field ranging from -10×10-4 T to +10×10-4 T, being about 27 times that of a giant magnetoresistance sensor.
Keywords
bismuth compounds; calcium compounds; copper compounds; electric sensing devices; lead compounds; magnetic sensors; magnetoresistance; magnetoresistive devices; quenching (thermal); sensitivity; sintering; strontium compounds; temperature; thick film devices; -10E-4 to 10E-4 T; 5 hour; 77.4 K; 845 C; BPSCCO; BPSCCO thick film; Bi-Pb-Si-Ca-Cu-O; bismuth lead strontium calcium copper oxide; liquid nitrogen boiling point; magnetic sensitivity; magnetic sensor; magnetoresistance sensor; quenching process; residual resistance; resistivity; sintering time; Conductivity; Electric resistance; Fabrication; Furnaces; Giant magnetoresistance; Magnetic films; Magnetic liquids; Magnetic sensors; Nitrogen; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2004. Proceedings of IEEE
Print_ISBN
0-7803-8692-2
Type
conf
DOI
10.1109/ICSENS.2004.1426362
Filename
1426362
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