DocumentCode :
3122900
Title :
Spin-hall assisted STT-RAM design and discussion
Author :
Eken, E. ; Zhang, Y. ; Yan, B. ; Wu, W. ; Li, H. ; Chen, Y.
Author_Institution :
Electr. & Comput. Enginnering, Univ. of Pittsburgh, Pittsburgh, PA, USA
fYear :
2015
fDate :
11-15 May 2015
Firstpage :
1
Lastpage :
1
Abstract :
Conventional spin-transfer torque random access memory (STT-RAM) is a promising technology due to its non-volatility and dense cell structure. However, the long switching time of magnetic tunneling junction (MTJ) limits the write speed of the STT-RAM. In order to improve the write performance, a Spin-Hall Effect (SHE) assisted STT-RAM structure (SHE-RAM) has recently been proposed [1]. SHE effect eliminates the incubation delay existing in conventional STT-RAM switching and consequently, reduces the switching time and write energy. The corresponding read and write schemes have been also proposed [2][4]. However, the schemes in [2] suffer from a sharp writing pulse and require an external magnetic field created by a permanent magnet, introducing very high power consumption. In the design in [4], a single bit needs to be represented by two MTJs and four transistors. Such a design largely sacrifices the storage density as well as the power consumption. Nonetheless, a design that can maximize the benefits of SHE effects is still highly desired. In this work, we proposed two new memory cell designs to improve the density and power consumption of SHE-RAM while still maintaining its speed advantage.
Keywords :
integrated circuit design; magnetic tunnelling; permanent magnets; random-access storage; spin Hall effect; high power consumption; magnetic tunneling junction; memory cell designs; permanent magnet; read-write schemes; spin-Hall assisted STT-RAM design; spin-transfer torque random access memory; switching time; transistors; write energy; Magnetic tunneling; Power demand; Random access memory; Switches; Transistors; Turning; Writing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7321-7
Type :
conf
DOI :
10.1109/INTMAG.2015.7156644
Filename :
7156644
Link To Document :
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