• DocumentCode
    3123254
  • Title

    Parametric study of pool boiling from porous graphite foams in dielectric liquids

  • Author

    Jin, Liwen ; Indro, Pranoto ; Leong, Kai Choong ; Chai, John C.

  • Author_Institution
    Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2010
  • fDate
    19-22 Dec. 2010
  • Firstpage
    19
  • Lastpage
    25
  • Abstract
    An experimental investigation of pool boiling on porous graphite foams is presented in this paper. A compact thermosyphon was developed to conduct the experiments using different types of graphite foams as evaporator inserts. Two dielectric liquids viz. FC-12 and HFE-700 were used as phase change coolants to investigate the effects of pore diameter and thermal conductivity of the foams on pool boiling heat transfer. It is found that the boiling heat transfer is affected by phase change coolant types. The difference of thermophysical properties between FC-12 and HFE-7000 resulted in different boiling characteristics on porous graphite foams. The experimental results indicate that thermal conductivity and pore diameter exhibit an interrelated effect on boiling performance. The compromise of these foam properties affects the bubble departure frequency which dominates the boiling heat transfer coefficient. This study demonstrates that the designed air-cooled thermosyphon can maintain the heater surface temperature below 85°C at heat flux of 112 W/cm2.
  • Keywords
    boiling; bubbles; cooling; design engineering; dielectric liquids; electrohydrodynamics; evaporation; flow through porous media; graphite; metal foams; thermal conductivity; C; FC-12 liquid; HFE-7000 liquid; air-cooled thermosyphon design; boiling heat transfer coefficient; bubble departure frequency; dielectric liquid; evaporator insert system; foam thermal conductivity; heater surface temperature; pool boiling characteristics; pool boiling heat transfer; pore diameter effect; porous graphite foam; thermophysical properties; Conductivity; Coolants; Copper; Heat transfer; Heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on
  • Conference_Location
    Cairo
  • Print_ISBN
    978-1-61284-268-4
  • Type

    conf

  • DOI
    10.1109/THETA.2010.5766375
  • Filename
    5766375