Title :
Thermo-mechanical modeling of RF MEMS devices
Author :
Rezvanian, O. ; Zikry, M.A.
Author_Institution :
Dept. of Mech. & Aerosp. Eng.., North Carolina State Univ., Raleigh, NC, USA
Abstract :
Time-dependent thermoelectromechanical behavior of metal contacts in microelectromechanical system (MEMS) devices and packaging is studied. The analysis relates the electrical constriction resistance to contact temperature and contact surface evolution over time, using a microcontact asperity creep model for metal microcontacts under continual applied or residual stresses. The effects of contact temperature on constriction resistance are investigated. This work provides guidance toward the rational design of microcontacts with enhanced reliabilities by better defining variables that control the electrical resistance at such microcontcats.
Keywords :
micromechanical devices; thermal stresses; RF MEMS devices; electrical constriction resistance; electrical resistance; metal microcontacts; microcontact asperity creep model; microelectromechanical system; residual stresses; thermo-mechanical modeling; time-dependent thermoelectromechanical behavior; Contacts; Creep; Resistance; Stress; Temperature distribution; Temperature measurement; Temperature sensors;
Conference_Titel :
Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on
Conference_Location :
Cairo
Print_ISBN :
978-1-61284-268-4
DOI :
10.1109/THETA.2010.5766380
