DocumentCode
3123793
Title
Materials reliability in MEMS devices
Author
Brown, Stuart B. ; Van Arsdell, William ; Muhlstein, Christopher L.
Author_Institution
Failure Anal. Assoc., Framingham, MA, USA
Volume
1
fYear
1997
fDate
16-19 Jun 1997
Firstpage
591
Abstract
Reliable operation of MEMS requires development of accelerated testing techniques and protocols. One such technique using resonant fatigue specimens has demonstrated a failure mode that was previously unknown. This work indicates that moisture can decrease the lifetime of cyclicly stressed polysilicon components
Keywords
corrosion fatigue; elemental semiconductors; environmental testing; fatigue cracks; fatigue testing; life testing; micromechanical devices; moisture; semiconductor device reliability; semiconductor device testing; silicon; MEMS devices; Si; accelerated testing techniques; cyclicly stressed polysilicon components; failure mode; lifetime; materials reliability; moisture; protocols; reliable operation; resonant fatigue specimens; Fatigue; Frequency; Materials reliability; Microelectromechanical devices; Micromechanical devices; Moisture; Resonance; Silicon; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location
Chicago, IL
Print_ISBN
0-7803-3829-4
Type
conf
DOI
10.1109/SENSOR.1997.613720
Filename
613720
Link To Document