Title :
Optical Through-Wafer Interconnects for 3D Hyper-Integration
Author :
Thacker, H. ; Ogunsola, O. ; Carson, A. ; Bakir, M. ; Meindl, J.
Author_Institution :
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA
fDate :
Oct. 29 2006-Nov. 2 2006
Abstract :
In this paper, we present the design, fabrication, and demonstration of optical through-wafer interconnects (TWIs). The interconnects were built using standard CMOS and MEMS fabrication processes
Keywords :
optical design techniques; optical fabrication; optical interconnections; 3D hyper-integration; optical through-wafer interconnect fabrication; optical through-wafer interconnects; standard CMOS process; standard MEMS fabrication process; Dielectric substrates; Etching; Integrated circuit interconnections; Integrated optics; Mirrors; Optical device fabrication; Optical interconnections; Optical polymers; Optical refraction; Optical waveguides;
Conference_Titel :
Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-9556-5
DOI :
10.1109/LEOS.2006.278802
