DocumentCode :
3124906
Title :
Low-K cu damascene interconnection leakage and process induced damage assessment
Author :
Aum, Paul
Author_Institution :
Spider Systems
fYear :
2004
fDate :
2004
Firstpage :
295
Lastpage :
295
Keywords :
Integrated circuit interconnections; Integrated circuit synthesis; Integrated circuit technology; Production systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
Print_ISBN :
0-7803-8528-4
Type :
conf
DOI :
10.1109/ICICDT.2004.1309966
Filename :
1309966
Link To Document :
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