Title :
Low-Cost Hybrid Photonic Integrated Circuits using Passive Alignment Techniques
Author_Institution :
CIP Ltd., Martlesham Heath, Ipswich
Abstract :
This paper describes a platform approach to achieve passive assembly of single-mode photonic components with high performance and low cost. The platform uses mode expanded and precision cleaved active semiconductor devices which are then passively assembled on PLC motherboards
Keywords :
hybrid integrated circuits; integrated optics; passive networks; semiconductor optical amplifiers; PLC motherboards; SOA; low-cost hybrid photonic integrated circuits; mode expanded active semiconductor devices; passive alignment techniques; precision cleaved active semiconductor devices; single-mode photonic components; Assembly; Cost function; Integrated optics; Monolithic integrated circuits; Optical arrays; Optical devices; Photonic integrated circuits; Semiconductor devices; Semiconductor optical amplifiers; Silicon compounds;
Conference_Titel :
Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-9555-7
Electronic_ISBN :
0-7803-9555-7
DOI :
10.1109/LEOS.2006.278874
