• DocumentCode
    3124957
  • Title

    Reflectance Forehead Pulse Oximetry: Effects of Contact Pressure During Walking

  • Author

    Dresher, Russell P. ; Mendelson, Yitzhak

  • Author_Institution
    Dept. of Biomed. Eng., Worcester Polytech. Inst., MA
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    3529
  • Lastpage
    3532
  • Abstract
    Steady progress has been made towards the development of a reliable wearable pulse oximeter to aid first responders in remote monitoring and triage operations. This study was undertaken to assess how varying contact pressures affects the photoplethysmographic (PPG) signal, and arterial oxygen saturation (SpO2) and heart rate (HR) measurement errors during motion artifact inducing activity. The study revealed that contact pressures ranging from 8-12 kPa resulted in the largest PPG amplitude for a reflectance sensor attached to the forehead region above the eye, although the signal-to-noise ratio (SNR) did not improve significantly. However, SpO2 and HR errors increased when insufficient contact pressure was applied. This information may be helpful in the design of a more robust pulse oximeter sensor for use in remote monitoring applications
  • Keywords
    biomechanics; biomedical equipment; blood vessels; cardiology; measurement errors; optical sensors; oximetry; oxygen; plethysmography; 8 to 12 kPa; SNR; arterial oxygen saturation; contact pressure; heart rate measurement error; motion artifact inducing activity; photoplethysmographic signal; reflectance forehead pulse oximetry; reflectance sensor; remote monitoring; signal-to-noise ratio; triage operations; walking; wearable pulse oximeter; Biomedical engineering; Biomedical monitoring; Forehead; Heart rate; Legged locomotion; Measurement errors; Pulse measurements; Reflectivity; Remote monitoring; Signal to noise ratio;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.260136
  • Filename
    4462558