DocumentCode :
3124985
Title :
Effect of channel width, length, and latent damage on NBTI
Author :
Cellere, G. ; Valentini, M.G. ; Paccagnella, Alessandro
Author_Institution :
Dept. of Inf. Eng., Padova Univ., Italy
fYear :
2004
fDate :
2004
Firstpage :
303
Lastpage :
306
Abstract :
pMOSFETs negatively biased under operating conditions and subjected to high temperature experience a progressive threshold voltage shift (Negative Bias Temperature Instability, NBTI). NBTI depends on several technological factors. We are showing in this paper a comprehensive study which discuss the NBTI dependence on channel length and channel width: overall, devices with shorter and wider channel are the most sensitive to NBTI. We are also discussing the strong sensitivity of NBTI to latent plasma induced damage: this makes NBTI a reliable index of latent damage.
Keywords :
MOSFET; interface states; plasma materials processing; semiconductor device breakdown; semiconductor device reliability; sputter etching; channel length; channel width; high temperature; interface states; latent damage index; latent plasma induced damage; long time reliability; negative bias temperature instability; pMOSFET devices; positive charge trapping; progressive threshold voltage shift; MOSFETs; Negative bias temperature instability; Niobium compounds; Plasma devices; Plasma temperature; Stress; Temperature dependence; Temperature sensors; Threshold voltage; Titanium compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
Print_ISBN :
0-7803-8528-4
Type :
conf
DOI :
10.1109/ICICDT.2004.1309971
Filename :
1309971
Link To Document :
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