• DocumentCode
    3125066
  • Title

    Monte-Carlo simulation of the effects of vacuum ultraviolet radiation on electronic materials

  • Author

    Upadhyaya, G.S. ; Shohet, J.L. ; Lauer, J.L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    335
  • Lastpage
    340
  • Abstract
    Radiation induced damage during the plasma processing of semiconductor materials adversely affects device reliability. Our group has shown in the past that Vacuum Ultraviolet (VUV) radiation (10nm-200nm) can beneficially deplete the charge deposited on the surface of the semiconductor by temporarily increasing the conductivity of the dielectric. The increase in conductivity has mainly been attributed to the generation of photoemission current and formation of electron hole pairs in the dielectric. In this paper, we discuss the steps involved in developing a model for VUV-semiconductor dielectric interactions based on the well-known Monte Carlo method. The statistical information obtained from this simulation will be compared to the experimental values obtained by exposing silicon nitride wafers to synchrotron radiation of energy 20eV. The simulation predicts the surface potential on the wafer due to photoemission. Experimentally measured surface potentials on the dielectric are used to check the validity of the simulation. Of the different process that can occur when a photon is incident on an atom, we concentrate mainly on photoemission of an electron. Consequently, the elastic and inelastic scattering events experienced by the electron during the course of its motion inside the dielectric are also considered. A modified form of the screened Rutherford formula, which approximates the Mott cross-section, as developed by Browning et. al., has been applied in this simulation. Initial simulation results will be presented.
  • Keywords
    Monte Carlo methods; photoemission; plasma materials processing; semiconductor device reliability; silicon compounds; sputter etching; surface charging; surface potential; synchrotron radiation; ultraviolet radiation effects; 20 eV; Monte-Carlo simulation; Mott cross-section; Si3N4; charge density; device reliability; elastic scattering events; electronic materials; inelastic scattering events; modified screened Rutherford formula; photoemission; photon penetration depth; plasma processing; radiation induced damage; surface potential; vacuum ultraviolet radiation effects; Conducting materials; Conductivity; Dielectric materials; Electrons; Materials reliability; Photoelectricity; Plasma devices; Plasma materials processing; Plasma simulation; Semiconductor materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology, 2004. ICICDT '04. International Conference on
  • Print_ISBN
    0-7803-8528-4
  • Type

    conf

  • DOI
    10.1109/ICICDT.2004.1309977
  • Filename
    1309977