DocumentCode :
3125193
Title :
Integrated position sensing for control of XY actuator
Author :
Hartwell, Peter G. ; Walmsley, Robert G. ; Fasen, Donald J. ; Hoen, Storrs
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
fYear :
2004
fDate :
24-27 Oct. 2004
Firstpage :
1407
Abstract :
We present an integrated capacitance based sensor and electronics system for measuring the position of a two axis microelectromechanical (MEMS) stage. Integrated position sensing enables closed-loop operation of the stage, greatly increasing system performance compared to previous micro-stages. The 2 mm square stage is fabricated in a bonded wafer process and is actuated using a bipolar, electrostatic surface drive. Sensor and actuator electrodes are positioned on the bottom of the stage increasing the available moving area of the stage to 50% of the chip size. Individual sensors for each axis and high aspect ratio flexures minimize sensor crosstalk from in-plane motion. The sensor electronics rejects signals from out-of-plane motion of the stage or sensors. The stage is capable of 50 μm of travel in each axis with maxima for velocity and acceleration of 40 mm/s and 200 m/s2, respectively. Sensor resolution has been measured at 2 Å in a 10 Hz bandwidth, giving the system near part-per-million position resolution.
Keywords :
acceleration; capacitive sensors; closed loop systems; crosstalk; microactuators; micromachining; micropositioning; microsensors; position measurement; signal resolution; velocity; 0 to 40 mm/s; 10 Hz; 2 A; 2 mm; 50 micron; XY actuator; acceleration; actuator electrodes; bipolar electrostatic surface drive; bonded wafer process; closed-loop operation; electronics system; in-plane motion; integrated capacitive sensor; integrated position sensing; out-of-plane motion signal rejection; position measurement; position resolution; sensor crosstalk; sensor electrodes; sensor resolution; two axis MEMS stage; two axis microelectromechanical stage; velocity; Actuators; Capacitance measurement; Capacitive sensors; Electrodes; Electrostatic measurements; Micromechanical devices; Position measurement; Sensor systems; System performance; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2004. Proceedings of IEEE
Print_ISBN :
0-7803-8692-2
Type :
conf
DOI :
10.1109/ICSENS.2004.1426448
Filename :
1426448
Link To Document :
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