DocumentCode :
3125205
Title :
Thermal modeling of micro-hotplates for integrated sensor applications
Author :
Wong, Darwin T W ; Chan, Philip C.H. ; Sheng, Lie-yi ; Sin, Johnny K O
Author_Institution :
Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
fYear :
1997
fDate :
35672
Firstpage :
149
Lastpage :
152
Abstract :
Micromachined micro-hotplate (MHP) is used in integrated gas sensors to heat SnO2 sensing film to the high operating temperature with milli-watts of power. This paper reports a detailed thermal modeling study of the MHP using 3-D finite element analysis. Three MHP structures were analyzed. Their thermal characteristics were compared
Keywords :
finite element analysis; gas sensors; microsensors; thermal analysis; tin compounds; 3D finite element analysis; SnO2; SnO2 film; integrated gas sensor; micromachined micro-hotplate; thermal model; Boundary conditions; Bridges; Conducting materials; Etching; Finite element methods; Gas detectors; Heat transfer; Silicon; Steady-state; Temperature sensors; Thermal conductivity; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1997. Proceedings., 1997 IEEE Hong Kong
Print_ISBN :
0-7803-3802-2
Type :
conf
DOI :
10.1109/HKEDM.1997.642353
Filename :
642353
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3125205
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