• DocumentCode
    3125205
  • Title

    Thermal modeling of micro-hotplates for integrated sensor applications

  • Author

    Wong, Darwin T W ; Chan, Philip C.H. ; Sheng, Lie-yi ; Sin, Johnny K O

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
  • fYear
    1997
  • fDate
    35672
  • Firstpage
    149
  • Lastpage
    152
  • Abstract
    Micromachined micro-hotplate (MHP) is used in integrated gas sensors to heat SnO2 sensing film to the high operating temperature with milli-watts of power. This paper reports a detailed thermal modeling study of the MHP using 3-D finite element analysis. Three MHP structures were analyzed. Their thermal characteristics were compared
  • Keywords
    finite element analysis; gas sensors; microsensors; thermal analysis; tin compounds; 3D finite element analysis; SnO2; SnO2 film; integrated gas sensor; micromachined micro-hotplate; thermal model; Boundary conditions; Bridges; Conducting materials; Etching; Finite element methods; Gas detectors; Heat transfer; Silicon; Steady-state; Temperature sensors; Thermal conductivity; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1997. Proceedings., 1997 IEEE Hong Kong
  • Print_ISBN
    0-7803-3802-2
  • Type

    conf

  • DOI
    10.1109/HKEDM.1997.642353
  • Filename
    642353
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3125205