DocumentCode :
31255
Title :
LDMOS Modeling
Author :
Szhau Lai ; Fager, Christian ; Kuylenstierna, Dan ; Angelov, Iltcho
Author_Institution :
Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Göteborg, Sweden
Volume :
14
Issue :
1
fYear :
2013
fDate :
Jan.-Feb. 2013
Firstpage :
108
Lastpage :
116
Abstract :
This article describes the detailed efforts of the winning contribution of the first student competition in microwave transistor modeling, held at the 2012 International Microwave Symposium (IMS2012) in Montreal, Quebec, Canada. The competition was sponsored by MTT-1, Freescale Semiconductor Inc., and WIN Semiconductor Inc. The transistor modeled was a commercially available high-power device from Freescale, and the characterization data required for modeling was distributed to all competitors. No measurements were to be carried out by the participants, so all students world wide, even those without expensive transistor characterization equipment, could participate. The main objectives of the competition were to identify the technology and develop a nonlinear model from the provided measurement data set [e.g., cold field effect transistor (FET) measurements, pulsed IV, IV versus temperature, S parameter versus bias, and pulsed S-parameter measurements]. The developed model was also to be validated versus large signal one- and two-tone measurements. The validation data was in the form of output power and power added efficiency (PAE) versus input power and measured at two different conditions, e.g., input/output terminations for maximum efficiency and maximum output power, respectively. An accurate model should be able to predict the large signal measurements across the full range of input power levels and bias points available. The judgment of the modeling result was based on the agreement between model simulation and measurement in terms of output power, efficiency, and third-order intermodulation (IM3) versus input power, several of which were not provided to the competitors.
Keywords :
MIS devices; intermodulation measurement; microwave transistors; semiconductor device measurement; semiconductor device models; 2012 International Microwave Symposium; Canada; Freescale Semiconductor Inc; IM3; IMS2012; LDMOS modeling; MTT-1; Montreal; PAE; WIN Semiconductor Inc; bias points available; expensive transistor characterization equipment; high-power device; input-output terminations; large signal one-measurement; measurement data set; microwave transistor modeling; nonlinear model; power added efficiency; third-order intermodulation; two-tone measurements; Capacitance; Equations; Integrated circuit modeling; Logic gates; Mathematical model; Temperature measurement; Transistors;
fLanguage :
English
Journal_Title :
Microwave Magazine, IEEE
Publisher :
ieee
ISSN :
1527-3342
Type :
jour
DOI :
10.1109/MMM.2012.2226628
Filename :
6421092
Link To Document :
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