DocumentCode
3125675
Title
Wafer Scale Assembly and Test for the Production of Opto-Electronic Components
Author
Kropp, Joerg R.
Author_Institution
EZconn Europe GmbH, Berlin
fYear
2006
fDate
Oct. 2006
Firstpage
168
Lastpage
169
Abstract
The trend of rising performance in combination with the reduction of size is still valid in the opto-electronic technology. That implies not only higher integration of functions into the chip but also a miniaturization of the hybrid assembly. It is presented a micro-assembly production line which uses a wafer as basis for the assembly process with mum accuracy. This technology is well suited for volume production since several thousand micro-systems are processed and tested on one wafer
Keywords
integrated optics; micro-optics; microassembling; optoelectronic devices; production testing; wafer-scale integration; micro-assembly production line; opto-electronic components; volume production; wafer scale assembly; wafer testing; Assembly; Costs; Manufacturing; Optical devices; Optical interconnections; Optical receivers; Optical sensors; Optical transmitters; Production; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
Conference_Location
Montreal, Que.
Print_ISBN
0-7803-9555-7
Electronic_ISBN
0-7803-9555-7
Type
conf
DOI
10.1109/LEOS.2006.278945
Filename
4054109
Link To Document