DocumentCode :
3125709
Title :
Impact of Hot-Pressing Parameters and Climate Temperature on VOC Emission from Particleboard
Author :
Wang, Jingxian ; Shen, Jun ; Zhanhua Huang ; Cao, Lianying
Author_Institution :
Coll. of Mater. Sci. & Eng., Northeast Forestry Univ., Harbin, China
fYear :
2010
fDate :
18-20 June 2010
Firstpage :
1
Lastpage :
3
Abstract :
Volatile organic compounds (VOCs) emitted from larch particleboard at different temperatures were studied in this paper. The small climate chamber and portable VOC gas monitor were used to measure VOCs quantities. Particleboard 1 (with hot-pressing time 3.5 min and hot-pressing pressure 35 MPa) and particleboard 2 (with hot-pressing time 2.7 min and hot-pressing pressure 30 MPa) were respectively examined at climate temperatures of 15, 23, 25, and 35°C. At a temperature of 23°C, particleboard 1 showed a higher initial emission than particleboard 2. VOC emissions from particleboards at 35°C were higher than ones at other temperatures. The emission study shows that hot-pressing parameters of particleboard and climate temperature have obvious effect on VOC emission. With the extension of hot-pressing time and the increase of hot-pressing pressure, VOC emissions increase. The increase of temperature can accelerate VOC emissions. On the other hand, temperature markedly affects the short-term emissions and it has less impact on the long-term emissions.
Keywords :
air pollution; hot pressing; organic compounds; VOC emission; climate temperature; hot pressing parameter; larch particleboard; pressure 30 MPa; pressure 35 MPa; temperature 15 degC; temperature 23 degC; temperature 25 degC; temperature 35 degC; time 2.7 min; time 3.5 min; volatile organic compound; Educational institutions; Forestry; Humidity; Manufacturing; Materials science and technology; Monitoring; Organic compounds; Temperature; Testing; Volatile organic compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bioinformatics and Biomedical Engineering (iCBBE), 2010 4th International Conference on
Conference_Location :
Chengdu
ISSN :
2151-7614
Print_ISBN :
978-1-4244-4712-1
Electronic_ISBN :
2151-7614
Type :
conf
DOI :
10.1109/ICBBE.2010.5516661
Filename :
5516661
Link To Document :
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