Title :
PSpice Modeling of Thermal Performance in Laser Diodes Packaging
Author :
Zhou, Sheng ; Zhang, Xiupu
Author_Institution :
Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que.
Abstract :
A PSpice model for laser diodes packaging was established to simulate its thermal behavior and cooling performance. Some heuristic analysis has been made by this model with concept clarity and simplicity
Keywords :
SPICE; cooling; semiconductor device models; semiconductor device packaging; semiconductor lasers; thermal management (packaging); PSpice modeling; cooling performance; heuristic analysis; laser diodes packaging; thermal performance; Capacitors; Circuit simulation; Cooling; Diode lasers; Packaging; Superluminescent diodes; Temperature control; Thermal conductivity; Thermal resistance; Thermistors;
Conference_Titel :
Lasers and Electro-Optics Society, 2006. LEOS 2006. 19th Annual Meeting of the IEEE
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-9555-7
Electronic_ISBN :
0-7803-9555-7
DOI :
10.1109/LEOS.2006.278947
