DocumentCode
3126377
Title
Evolution of VLSI reliability engineering
Author
Crook, D.L.
Author_Institution
Intel Corp., Hillsboro, OR, USA
fYear
1990
fDate
27-29 March 1990
Firstpage
2
Lastpage
11
Abstract
Projection indicates that by the turn of the century microcomputer chips will have 100 million transistors and failure rates of less than 10 FIT. Traditional accelerated product life tests and wafer-level reliability measurement techniques presently being developed will have severe limitations in resolving the 10 FIT failure rate of complex VLSI circuits. These limitations are discussed, along with the change in direction that the reliability engineering and manufacturing community will have to take over the next decade to meet the challenge of continuously decreasing failure rate goals.<>
Keywords
VLSI; circuit reliability; failure analysis; life testing; VLSI reliability engineering; accelerated product life tests; complex VLSI circuits; failure rate goals; failure rates; manufacturing community; microcomputer chips; reliability engineering; transistors; wafer-level reliability measurement techniques; Circuit testing; Life estimation; Life testing; Manufacturing; Measurement techniques; Microcomputers; Physics; Random access memory; Reliability engineering; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1990. 28th Annual Proceedings., International
Conference_Location
New Orleans, LA, USA
Type
conf
DOI
10.1109/RELPHY.1990.66052
Filename
66052
Link To Document