• DocumentCode
    3126377
  • Title

    Evolution of VLSI reliability engineering

  • Author

    Crook, D.L.

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • fYear
    1990
  • fDate
    27-29 March 1990
  • Firstpage
    2
  • Lastpage
    11
  • Abstract
    Projection indicates that by the turn of the century microcomputer chips will have 100 million transistors and failure rates of less than 10 FIT. Traditional accelerated product life tests and wafer-level reliability measurement techniques presently being developed will have severe limitations in resolving the 10 FIT failure rate of complex VLSI circuits. These limitations are discussed, along with the change in direction that the reliability engineering and manufacturing community will have to take over the next decade to meet the challenge of continuously decreasing failure rate goals.<>
  • Keywords
    VLSI; circuit reliability; failure analysis; life testing; VLSI reliability engineering; accelerated product life tests; complex VLSI circuits; failure rate goals; failure rates; manufacturing community; microcomputer chips; reliability engineering; transistors; wafer-level reliability measurement techniques; Circuit testing; Life estimation; Life testing; Manufacturing; Measurement techniques; Microcomputers; Physics; Random access memory; Reliability engineering; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1990. 28th Annual Proceedings., International
  • Conference_Location
    New Orleans, LA, USA
  • Type

    conf

  • DOI
    10.1109/RELPHY.1990.66052
  • Filename
    66052