Title :
ST elevation or depression in subendocardial ischemia?
Author :
Potse, Mark ; LeBlanc, A.Robert ; Cardinal, Rene ; Vinet, Alain
Author_Institution :
Res. Center, Hosp. du Sacre-Coeur de Montreal, Que.
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
ST-segment depression in epicardial electrograms can be a "reciprocal" effect of remote myocardial ischemia (MI), and can also be due to local partial-thickness or "subendocardial" MI. Experimental studies have shown either ST elevation or depression in leads overlying a subendocardial ischemic region. Those reporting elevation have shown depression over the lateral borders of the ischemia. Simulation studies with anisotropic models have explained the ST-elevation results. Presently, while experimentalists may have difficulty understanding the ST elevation, most model studies fail to explain ST depression in overlying leads during partial-thickness ischemia. We have simulated partial-thickness ischemia in a 3-dimensional model of the human heart. Our results show that the conductivity of the intracavitary blood, geometry of the ischemic region, and bidomain anisotropy ratios can all have a decisive influence on the sign of the ST deviation. We hypothesize that ST depression in leads overlying an ischemic zone is due to subendocardial ischemia in tissue where a redistribution of gap junctions has taken place
Keywords :
bioelectric potentials; blood; digital simulation; electrical conductivity; electrocardiography; medical computing; muscle; physiological models; 3-dimensional model; ST-segment depression; ST-segment elevation; bidomain anisotropy ratios; conductivity; epicardial electrograms; human heart; intracavitary blood; partial-thickness ischemia; remote myocardial ischemia; subendocardial ischemic region; Anisotropic magnetoresistance; Biomembranes; Blood; Conductivity; Extracellular; Geometry; Heart; Humans; Ischemic pain; Myocardium;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.259485