Skin Penetration of Silicon Dioxide Microneedle Arrays

Author

Kim, Sangchae ; Shetty, Smitha ; Price, Dorielle ; Bhansali, Shekhar

Author_Institution

Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL

fYear

2006

fDate

Aug. 30 2006-Sept. 3 2006

Firstpage

4088

Lastpage

4091

Abstract

Out-of-plane hollow silicon dioxide microneedle arrays were fabricated and investigated to determine their efficacy for transdermal applications. The fabrication process of the SiO₂ microneedles is described, and mechanical fracture forces were investigated on microneedles with different geometrical dimensions. Biomechanical characterization of the microneedles was performed to specifically test for reliable stratum corneum and skin insertion by changing the regulatory parameters such as needle width and cross-section

Keywords

bioMEMS; biomechanics; fracture; needles; silicon compounds; skin; MEMS; SiO₂; biomechanical characterization; fabrication process; geometrical dimensions; mechanical fracture forces; needle cross-section; needle width; regulatory parameters; silicon dioxide microneedle arrays; skin insertion; skin penetration; stratum corneum; transdermal applications; Cities and towns; Drugs; Fabrication; Force measurement; Needles; Silicon compounds; Skin; Testing; USA Councils; Wet etching; MEMS; Microneedle; Skin; Stratum Corneum;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE

Conference_Location

New York, NY

ISSN

1557-170X

Print_ISBN

1-4244-0032-5

Electronic_ISBN

1557-170X

Type

conf

DOI

10.1109/IEMBS.2006.260142

Filename

4462699