Title :
A 77 GHz broadband flip-chip transition on LTCC submount
Author :
Schmückle, F.J. ; Pursche, U. ; Heinrich, Wolfgang ; Purden, Joe
Author_Institution :
Ferdinand-Braun-Inst. (FBH), Berlin, Germany
Abstract :
A flip-chip interconnect of a SiGe chip to an LTCC submount with microstrip feeding line is presented. In order to be compatible with cost-effective submount solutions, bumps with 125 μm diameter and 100 μm design rules on the LTCC side are applied. Also, the use of vias is avoided. Although the dimensions are relatively large for the 77 GHz range, transitions with 10 GHz bandwidth are achieved. Test structures were manufactured and measurement results show good agreement with simulation yielding less than 1 dB of insertion loss at 77 GHz.
Keywords :
Ge-Si alloys; ceramic packaging; flip-chip devices; integrated circuit interconnections; millimetre wave integrated circuits; LTCC submount; SiGe; broadband flip-chip transition; flip-chip interconnect; frequency 10 GHz; frequency 77 GHz; microstrip feeding line; size 100 mum; size 125 mum; Bandwidth; Costs; Dielectric loss measurement; Germanium silicon alloys; Loss measurement; Microstrip; Semiconductor device measurement; Silicon germanium; Substrates; Testing; Flip-Chip; LTCC; Radial stub; Transition; em simulation;
Conference_Titel :
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-4244-6056-4
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2010.5516751
