DocumentCode :
3128177
Title :
Advanced Systems: ULSI Versus High-density Packaging
Author :
Jerclonek, R.
Author_Institution :
General Electric
fYear :
1991
fDate :
13-15 Feb. 1991
Firstpage :
202
Lastpage :
203
Keywords :
Assembly; Costs; Electronics packaging; Integrated circuit interconnections; Production; Semiconductor device packaging; TV; Time to market; Ultra large scale integration; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1991. Digest of Technical Papers. 38th ISSCC., 1991 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-644-6
Type :
conf
DOI :
10.1109/ISSCC.1991.689127
Filename :
689127
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3128177
بازگشت