DocumentCode
3128577
Title
High performance integrated circuit packaging
Author
Johnson, Barry C.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear
1988
fDate
16-19 May 1988
Abstract
A tutorial overview is provided of high-performance integrated-circuit packaging. The approach is to (1) present the current trends in circuit performance, (2) discuss their impact on current packaging methods, and (3) present packaging concepts that are being offered as potential solutions. Particular emphasis is placed on design guidelines and material requirements
Keywords
VLSI; cooling; digital integrated circuits; integrated circuit technology; packaging; ULSI; VLSI; circuit performance; cooling; design guidelines; high performance IC packaging; material requirements; packaging concepts; packaging methods; pincount; potential solutions; trends; tutorial overview; Bipolar integrated circuits; CMOS integrated circuits; CMOS logic circuits; Electronic packaging thermal management; Integrated circuit packaging; Microprocessors; Pins; Random access memory; Semiconductor device packaging; Signal processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 1988., Proceedings of the IEEE 1988
Conference_Location
Rochester, NY
Type
conf
DOI
10.1109/CICC.1988.20918
Filename
20918
Link To Document