The development trend of halogen-free substrate cores

A majority of OEMs have announced their plans to use non-halogenated circuit boards in 2008, and this decision has helped to accelerate the development schedule of halogen-free substrate cores. As electronic components are getting smaller, while at the same time the materials are switching to halogen free, the substrate cores have to enhance related characteristics, such as lower co-efficient of thermal expansion, higher stiffness, and reduced coplan situation, and so on. However, due to the fact that halogen free materials possess higher water absorption and transforms system in lead free with higher temperature, the substrate cores are required to survive stricter reliability challenges. We have developed highly reliable substrate cores, which can meet the demand of halogen free materials through a series of reliability testing. To meet the stricter environmental challenges, we subsequently approached a new halogen-free and phosphorous-free substrate material, which is composed of nitrogen-containing resin, inorganic filler, and modifier. The new material has higher Tg, lower CTE, and better thermal resistance with halogen free and phosphorous free. It not only can render excellent properties but also can be more environmentally friendly.